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Showing posts with the label surface mount technology

Top Trends in ESDM and PCB Assembly You Need to Know

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  The Electronics System Design and Manufacturing (ESDM) sector is at the forefront of innovation, powering advancements across industries like automotive, medical technology, telecom, and aerospace. At the core of ESDM lies Printed Circuit Board (PCB) assembly — the foundation upon which modern electronics are built. As global demand for smarter, faster, and more compact electronic devices grows, the industry is witnessing rapid transformation. At Aimtron, a leading EMS company in India and the USA, we stay ahead by embracing these shifts. Let’s explore the top trends shaping ESDM and PCB assembly today. 1. Miniaturization and High-Density PCB Designs Devices are shrinking, but their functionality is expanding. This has pushed PCB designs toward higher density and multi-layered boards with smaller components. Surface Mount Technology (SMT) is enabling more compact, efficient, and reliable assemblies. Aimtron’s SMT lines are equipped to handle high-density interconnect (HDI) des...

PCB ASSEMBLY & PRODUCTION PROCESS

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Within a printed circuit board electronics manufacturing process, there are a variety of stages. However, it is indispensable for them all to work collectively to develop a built-in process. An individual phase of assembly and manufacturing needs to be well-matched with the next, and there need to be comments from the output to the next phase to make sure that the best is maintained. In this way, any issue can be detected instantly and the system can be adjusted as per requirement. PCB assembly Process Overview All the phases involved in the PCB assembly processes are mandatory and have to be supervised to make sure that the product is of the best quality. The PCB Assembly described below suggests that the surface mount components are being used as truly all up-to-date before PCB's make use of surface mount technology. Solder paste Before mounting the components on the board, the solder paste is to be applied to the areas of the board, called the component pads. And the so...